DOWSIL SE 9185
Harmonization Code : 3208.20.90 | Paints and varnishes that are dispersed or dissolved in a non aqueous medium
Main features
- Fast Tack-Free Room-Temperature Cure
- High Elongation for Stress Relief
- Controlled Silicone Volatility
Product Description
DOWSIL SE 9185 is a one-part, non-flowing moisture-cure RTV silicone adhesive/sealant for electronics assembly. The product is described as translucent or white and is designed for sealing PCB system assemblies and modules and for fixing parts on circuit boards. It develops a tack-free surface in 8 minutes at 50% RH and cures at room temperature without mixing or a required oven cure. Typical cured properties include 515% elongation, Shore A 31 hardness, and 435 psi tensile strength, supporting flexible bonds and stress relief. Controlled silicone volatility further supports its use around electronic assemblies.
Key Features
- One-part moisture-cure RTV
- Non-flowing formulation
- 8-minute tack-free time at 50% RH
- 515% typical cured elongation
- Controlled silicone volatility
- Room-temperature cure with optional heat acceleration
Applications / Suitable for
- Sealing PCB system assemblies and modules
- Fixing parts on circuit boards
TDS, SDS & Technical Documents
Technical Specifications
Mechanical Properties
General Properties
Physical Properties
Electrical Properties
Additional Information
DOWSIL SE 9185
DOWSIL SE 9185 is a one-part, non-flowing moisture-cure RTV silicone adhesive/sealant developed for electronics assembly. It is used for sealing PCB system assemblies and modules and for fixing parts on circuit boards. The product combines fast tack-free room-temperature cure, high cured elongation for stress relief, and controlled silicone volatility.
Product profile
Room-temperature moisture cure with fast surface set
The one-part RTV format eliminates mixing and supports room-temperature processing. Tack-free time is 8 minutes at 50% RH. Cure time for adhesion is 3 to 7 days at 25 deg C. One-part moisture-cure processing is generally performed at room temperature and 30 to 80% relative humidity, with cure progressing from the exposed surface inward. Mild heat below 60 deg C may be used to accelerate cure.
Dispensing and cure geometry
- Suitable for automated or manual needle dispensing.
- Cure proceeds from the exposed surface inward at about 6 mm per 7 days under general one-part moisture-cure guidance.
- Highly confined spaces or deep-section cure applications are not typically suited to this cure mechanism.
Surface preparation and adhesion
- Surfaces should be thoroughly cleaned and degreased before bonding.
- Unprimed adhesion can be achieved on many reactive metals, ceramics and glass, and on selected laminates, resins and plastics.
- Substrate-specific testing is recommended because surface chemistry, contamination and joint design can materially affect bond performance.
Flexible cured silicone for stress-relieving bonds
High elongation is a key selection feature of DOWSIL SE 9185. Typical cured properties include 515% elongation, Shore A 31 hardness and 435 psi tensile strength, supporting the product's stated positioning for added stress relief.
| Property | Typical value | Condition / note |
|---|---|---|
| Specific gravity | 1.05 | At 25 deg C |
| Durometer hardness | 29 Shore A | Cured material |
| Tensile strength | 435 psi / 3.0 MPa | Typical cured value |
| Elongation | 515% | Typical cured value |
Typical property values are not intended for use as product specifications.
Electrical insulation data for electronics evaluation
Typical electrical properties include dielectric strength, volume resistivity, dielectric constant and dissipation factor for design evaluation.
| Property | Typical value | Test frequency / note |
|---|---|---|
| Dielectric strength | 22 kV/mm | 550 V/mil |
| Volume resistivity | 2.0 E+16 ohm*cm | Typical cured value |
| Dielectric constant | 2.8 | At 1 MHz |
| Dissipation factor | 0.0007 | At 1 MHz |
Typical property values are not intended for use as product specifications. Validate performance in the intended assembly and geometry.
Designed for PCB sealing and component fixing
DOWSIL SE 9185 is positioned for boards and assemblies, components and housings where a non-flowing, room-temperature-cure silicone adhesive can provide localized sealing or fixation without two-part mixing.
PCB system assembly sealing
Use for sealing PCB system assemblies and modules. The material is non-flowing and moisture-cures at room temperature.
Circuit-board parts fixing
Use for fixing parts on circuit boards. The product is one-part, non-flowing and designed for room-temperature moisture cure.
Protect the one-part RTV from premature moisture exposure
Storage
- Store at or below the storage temperature stated on the product label.
- Keep the product in its original packaging with the cover tightly attached.
- Use the material by the Use Before date shown on the product label.
Moisture control
- Prevent moisture from contacting uncured material during storage.
- Keep containers tightly closed and minimize headspace.
- Purge partially filled containers with dry air or another dry gas such as nitrogen.
Dow adhesives and sealants selection guide
Review DOWSIL SE 9185 alongside other Dow electronics adhesives and sealants, including cure system, processing behavior and comparative typical properties.
View the Dow adhesives and sealants selection guideEvaluate DOWSIL SE 9185 for your electronics assembly
Discuss PCB sealing, component fixing, joint geometry, dispensing, cure conditions and substrate compatibility with the technical team.
